Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
US6613609B1 · kind B1 · utility
9Cited by
10References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Oct 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method for producing a portable electronic device with an integrated circuit, a resin band is deposited around the chip of an integrated circuit and connection wires. The resin is highly viscous and can be polymerized with U.V. radiation. A low-viscosity filling resin which can be polymerized with U.V. radiation is deposited in the space defined by the resin band, and the protected resins are polymerized by exposure to U.V. radiation. The filling resin contains mechanically reinforcing fibers. The entire process can be carried out in a continuous manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.