Method for spin coating high viscosity materials on silicon wafers
US6613700B2 · kind B2 · utility
4Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Nov 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for spin coating high viscosity materials. Two dispense steps are used. The first dispense step dispenses a small amount (102) of high viscosity material at the center of the wafer (100). A high-speed wafer rotation spreads the material to form a thin layer (104) to prime the surface of the wafer (100) and lower the surface tension without regard to uniformity. A second dispense step occurs at lower RPM and coats (108) the wafer (100) more uniformly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.