Radiation shielding of three dimensional multi-chip modules
US6613978B2 · kind B2 · utility
7Cited by
85References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Jun 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.