Diamond component with rear side contact and a method for the production thereof
US6614095B1 · kind B1 · utility
4Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Feb 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a component which has a function element arranged on a substrate the function element being electrically contacted in a contact region on its rear side facing the substrate. The substrate has an opening in the contact region and the rear side of the function element is coated with a contact metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.