Plastic packaging of LED arrays
US6614103B1 · kind B1 · utility
199Cited by
24References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2000 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.