Controlling underfill flow locations on high density packages using physical trenches and dams
US6614122B1 · kind B1 · utility
49Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, comprising: a substrate having a surface; a die attached to the substrate surface; an underfill material positioned between the substrate surface and the die; and one or more barriers on the substrate surface adjoining the die, wherein the barriers controls flow of the underfill material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.