Method of manufacturing lens cap for transistor outline package
US6614602B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 2002 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | May 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a lens cap (40) for a transistor outline package includes the steps of: (a) providing a main part (2) of the lens cap; (b) providing an upper and lower molds (51, 52) and putting the main part into the molds; (c) closing the molds and insert molding a lens part (3). The product lens cap includes the lens part and the hollow main part, which is adapted for receiving optoelectronic components. The formed lens part includes a ball lens (30) and a sprue filling portion (31). The main part defines an opening (23), which includes a ball lens receiving hole (231) and a sprue (232). During the insert molding part of the process, the melted lens part material is injected through an injection hole (53) into the sprue, and then flows into the ball lens receiving hole, assuring good optical quality of the ball lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.