Disc drive head supporting mechanism having power supply pads for an integrated circuit which are of a greater area than signal/control junction pads
US6614623B2 · kind B2 · utility
19Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Jan 17, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To restrain temperature rise by controlling heat radiation from an IC. More specifically, an area of junctioning pads which are in contact with an IC is enlarged to substantially overlap the whole or at least half or more of the area of the IC. Further, the IC is covered with an overcoat which protrudes to other parts of a head supporting mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.