Heat sink for cooling an electronic component of a computer
US6614657B2 · kind B2 · utility
6Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Aug 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The heat sink is described which is used to cool an electronic component of a computer. The heat sink is constructed from a metal sheet which is bent so as to have a horizontal thermally conductive plate and four walls extending upwardly from the plate and jointly define an enclosure. Openings are formed in the walls through which air can flow by natural convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.