De-mountable, solderless in-line lead module package with interface
US6614659B2 · kind B2 · utility
20Cited by
11References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Dec 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/365
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for holding and securing an electrical module, IC, or other electronic components to a PCB that is easy to use and manipulate. The apparatus utilizes a transitional element to hold the electrical module or IC and then secure itself to the PCB using fasteners or the like. Preferred methods for assembling and using the apparatus are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.