Reducing impedance of power supplying system in a circuit board by connecting two points in one of a power supply pattern and a ground pattern by a resistive member
US6614663B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1999 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Jul 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a circuit board having a multilayer structure comprising a ground pattern and a power-supply pattern both, for example, by forming a plurality of slits along each side of the ground pattern or the power-supply pattern, a long thin conduction path connecting a corner and a side center of the ground pattern is formed and resistive elements are placed in the middles of the conduction path to short, circuit the corner and a side center of the ground pattern. Therefore, portions corresponding to an antinode and a node or antinode and an antinode of a standing wave are short-circuited. The standing wave is generated when electric power is supplied to ICs and LSIs mounted on the circuit board. Thus, noise sources caused by the standing wave cancel each other. As a result, the occurrence of an antiresonance phenomenon and an increase in impedance of the power supplying system caused by the standing wave can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.