Acoustic sensor array
US6614723B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Aug 6, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V2001/207
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An acoustic sensor array may include sensor sections positioned along a length of a strain member. One or more sensors may be disposed within a sensor section. One or more sensors may be encapsulated in a molding material using a reaction injection molding (RIM) process to form a sensor section. Buoyant sections may be formed between sensor sections on the strain member. Buoyant sections may be formed by encapsulating a portion of the strain member in a buoyant molding material using a RIM process. Buoyant sections and/or sensor sections may include hollow microspheres. A concentration of hollow microspheres may be adjusted to control a buoyancy of the array. The strain member, the sensor sections, and the buoyant sections may be joined to form the array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.