Patent · US Expired

Latent heat body

US6615906B1 · kind B1 · utility

20Cited by

16References

3Claims

0Family size

Assignee

SchÃƒÂ¼mann Sasol GmbH & Co. KG · DE

Inventors

Klaus Fieback · Michendorf, DE
Michael Matthai · Henstedt-Ulzburg, DE
Toni Haberschuss · Bad Saarow, DE

Key dates

Filing date	Mar 31, 2000
Grant date	Sep 9, 2003
Priority date	—
Expiry date	Mar 31, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/249953
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

Latent heat body (1) with paraffin-based latent heat storage material accommodated in a carrier material which has holding spaces, wherein the carrier material comprises fibres of an organic plastics material or natural material or of an inorganic material or of textile materials. The carrier material is assembled from individual carrier-material elements by adhesive bonding, capillary-like holding spaces for the latent heat storage material being formed at least between the carrier-material elements. The latent heat storage material is provided with a thickening agent for providing increased viscosity to the heat storage material while in a molten state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.