Porous vapor valve for improved loop thermosiphon performance
US6615912B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Aug 22, 2021 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/043
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention provides a loop thermosiphon including an evaporator and a condenser interconnected in flow communication by a vapor conduit and a condensate conduit. A wick is disposed in a portion of the evaporator and a portion of the at least one condensate conduit adjacent to the evaporator to facilitate capillary action to cycle a coolant fluid through the loop thermosiphon. Advantageously, a porous valve is lodged within the condensate conduit so that a first pressure on a condenser side of the porous valve is greater than a second pressure on an evaporator side of the porous valve. In this way, a portion of the liquid coolant fluid disposed within the loop thermosiphon is forced through the porous valve and a remaining portion is forced through the at least one condenser. In one embodiment, the porous valve comprises a plug of sintered material that is lodged within the condensate conduit so as to provide a seepage of coolant fluid during periods of low thermal energy transfer to the evaporator so as to avoid drying out of the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.