Aqueous solution for colloidal polishing of silicate substrates
US6616718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Sep 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A two-part reagent method for polishing an inorganic silicate substrate is provided. The method comprises: providing a silicate substrate; providing a reagent comprising: a first part consisting essentially of an aqueous solution of at least one metal oxide abrasive selected from the group consisting of titania, zirconia, germania, and germania-doped silica; and a second part consisting essentially of an alkali aqueous solution of colloidal silica having a buffered pH value of at least about 10; polishing a surface of said substrate with the metal oxide abrasive aqueous solution to a surface roughness (Ra) ranging from about 6 å to about 10 å; and further polishing the surface with said alkali aqueous solution of colloidal silica to a roughness of less than or equal to about 5 å.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.