Integral capacitance for printed circuit board using dielectric nanopowders
US6616794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 1999 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | May 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09309
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.