Metal laminate for a circuit board
US6616796B1 · kind B1 · utility
14Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2000 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2323/061
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of producing a metal laminate for a circuit board includes a first step of press-bonding a thermotropic liquid crystal polymer film 1 having a segment orientation ratio SOR within a range not smaller than 0.90 and smaller than 1.15 along the longitudinal direction of the film, to a metal sheet 3 between hot rolls while the thermotropic liquid crystal polymer film 1 is in a tense or non-tense state; and a second step of heating the laminate obtained in the first step to a temperature not lower than the melting point of the thermotropic liquid crystal polymer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.