Patent · US Expired

Preparation of adhesive bonds using carbodiimide-containing dispersions with heat activation

US6616797B1 · kind B1 · utility

6Cited by
12References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 24, 2000
Grant dateSep 9, 2003
Priority date
Expiry dateJan 24, 2020

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2475/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Adhesive bonds can be formed by a process that includes applying a dispersion containing a polyurethane which has structural units of formula (I)—N═C═N—  (I)to a surface. The dispersion is first coated onto the surface to form a coating. The coating is dried to give an essentially anhydrous coating. The dried coating is then subjected to heat activation. The adhesive bond is formed by joining the heat activated coating to itself or to another surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.