Solvent released encapsulated yeast
US6616954B1 · kind B1 · utility
15Cited by
3References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2002 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Mar 21, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC12N11/04
- WIPO fieldBiotechnology
- WIPO sectorChemistry
Abstract
The present invention is an encapsulated yeast composite comprising a core comprising yeast and a soluble coating comprising polyethylene glycol having a molecular weight less than 3050. The yeast includes Saccharomyces cerevisiae. The encapsulated composites are useful in the production of food compositions and food products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.