Patent · US Expired

Procedure and device for specific particle manipulation and deposition

US6616987B1 · kind B1 · utility

11Cited by

14References

12Claims

0Family size

Assignee

Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

Gregor Morfill · Birkenfeld, DE
Hubertus Thomas · Pfaffenhofen an der Ilm, DE
Timo Stuffler · Landsberied, DE
Uwe Konopka · Neufahrn, DE

Key dates

Filing date	Sep 29, 2000
Grant date	Sep 9, 2003
Priority date	—
Expiry date	Sep 29, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/32366
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A process for manipulating particles distributed substantially non-uniformly in a plasma of a carrier or reaction gas, wherein Coulomb interaction between the particles is so low that the particles substantially do not form a plasmacrystalline state, and the particles are exposed in a location-selective manner to external adjustment forces and/or the plasma conditions are subjected to a location-selective change to apply at least a portion of the particles onto a substrate surface mask-free and/or subject it to a location-selective plasma treatment in the carrier or reaction gas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.