Semiconductor device having identification number, manufacturing method thereof and electronic device
US6617172B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention aims to economically implement an ultra-compact semiconductor device having an identification number according to the efficient utilization of an electron-beam writing method.A memory for identifying a 128-bit identification number, which makes use of a transistor, is configured by each contact hole selectively defined by an electron-beam writing method. A plane long-side size of a semiconductor chip is set to 0.5 mm or less. The contact holes are defined simultaneously with contact holes for peripheral circuits. In addition, the plane long-side size of the semiconductor chip is set smaller than the thickness of a wafer prior to the start of its manufacture and set larger than the thickness of the post-thinning wafer. Otherwise, the same data as a barcode is further stored in the memory. Additionally, data obtained by enciphering the identification number is used to test or inspect the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.