Single component room temperature stable heat-curable acrylate resin adhesive
US6617371B2 · kind B2 · utility
6Cited by
23References
65Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Jun 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A single component liquid heat-curable adhesive formulation that is stable at room temperature. The formulation includes from about 5 to about 70 wt % of at least one acrylate monomer, from about 5 to about 94 wt % of an acrylate oligomer, and from about 0.1 to about 10 wt % of a thermal initiator selected from the group consisting of diacyl peroxides, benzoyl peroxides and peroxy esters. A photo initiator may be included thereby rendering the stable liquid formulation to be both heat-curable and UV-curable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.