Patent · US Expired

Polyamide resin composition and forming from the same

US6617381B1 · kind B1 · utility

13Cited by
33References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 4, 1998
Grant dateSep 9, 2003
Priority date
Expiry dateMar 4, 2018

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K9/08
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Disclosed is a polyamide resin composition, a method for producing the composition, and articles from the composition. The polyamide resin composition polyamide resin composition is formed by melt-kneading (A) 100 parts by weight of nylon resin, and (B) 5-150 parts by weight of at least one of a non-fibrous inorganic filler having an average particle diameter of 0.05-10 &mgr;m and a fibrous inorganic filler, excluding glass fiber, having a fiber diameter of 0.05-10 &mgr;m. In the polyamide resin composition, an amount of a polyamide resin component deposit remaining on the inorganic filler when the inorganic filler is recovered by dissolving the polyamide resin composition into hexafluoroisopropanol is at least 4 g/m2 per unit surface area of the inorganic filler measured by a BET method. The nylon resin composition is excellent in rigidity and toughness and particularly excellent in high-speed surface impact fracture characteristic. The resin composition also achieve excellent surface external appearance and excellent dimensional stability in good balance in a formed article. The resin composition can suitably be formed by injection forming, extrusion, blow forming and the like, i…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.