Apparatus for RF active compositions used in adhesion, bonding, and coating
US6617557B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2809
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An RF heating system. In one aspect of the present invention, the RF heating system includes a first elongated electrode connected to a first node within an impedance matching circuit and a second elongated electrode connected to a second node within the impedance matching circuit, wherein (a) a first portion of the first electrode and a first portion of the second electrode are adjacent to and substantially parallel with each other, (b) a second portion of the first electrode is angled in a direction away from the second electrode, (c) a second portion of the second electrode is angled in a direction away from the first electrode, and (d) a stray electromagnetic field is generated in a region above the space between the first portion of the first electrode and the first portion of the second electrode, whereby the generated stray field can be used to heat a composition when the composition is placed in the region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.