High-frequency integrated inductive winding
US6617665B2 · kind B2 · utility
4Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2002 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Apr 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/041
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An inductance formed in an integrated circuit chip, formed of a plurality of parallel conductive lines, of optimized width, each conductive line being formed in the thickness of at least one insulating layer, these lines being interconnected by at least one perpendicular conductive segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.