Surface PIN device
US6617670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/548
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A surface PIN (SPIN) device and a method of fabricating such a SPIN device. The SPIN device, when activated, confines carrier injection to a small volume near the surface of the device such that the device is sufficiently conductive to simulate a planar conductor. The SPIN device comprises a P+ region and an N+ region formed in an intrinsic (I) layer. The P+ and N+ regions are separated by a lateral length of intrinsic material of length L. The length L is approximately the carrier diffusion length. When DC bias is applied across the N+ and P+ regions carriers are injected into the intrinsic region at a density exceeding 1018 carriers per cubic cm. The intrinsic region is sufficiently thin to confine the carriers near the surface of the intrinsic region. As such, in the “on” state, the SPIN device simulates a conductive material. In the “off” state, the SPIN device is no longer conductive. Consequently, a planar array of SPIN devices can be fabricated and selectively activated to form a dynamic, reconfigurable antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.