Semiconductor package and method of preparing same

US6617674B2 · kind B2 · utility

Assignee

• Dow Corning Corporation · US

Inventors

• Gregory Scott Becker · Sanford, US
• Geoffrey Bruce Gardner · Gilbert, US
• Brian Harkness · Midland, US
• Louise Ann Malenfant · Midland, US
• Satyendra Kumar Sarmah · Midland, US

Key dates

• Filing date: Feb 20, 2001
• Grant date: Sep 9, 2003
• Expiry date: Mar 17, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.