Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
US6617795B2 · kind B2 · utility
162Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multichip light-emitting-diode package having a support member, at least two light-emitting-diode chips disposed on the support member, at least one sensor disposed on the support member for reporting quantitative and spectral information to a controller, relating to the light output of the light-emitting-diodes, and a signal processing circuit, including an analog-to-digital converter logic circuit, disposed on the support member for converting the analog signal output produced by the sensors to a digital signal output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.