Modular electronics enclosure
US6618250B2 · kind B2 · utility
2Cited by
11References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Aug 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.