Method for manufacturing a high resolution intravascular ultrasound transducer assembly having a flexible substrate
US6618916B1 · kind B1 · utility
86Cited by
45References
12Claims
0Family size
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Key dates
| Filing date | Apr 17, 2000 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Apr 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Several methods for fabricating an ultrasound transducer assembly having a flexible circuit are provided. Preferably, the method comprises attaching an ultrasound transducer array and integrated circuitry to the flexible circuit during fabrication of the ultrasound transducer assembly while the flexible circuit is in a:substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.