Heat exchanger for an electronic heat pump
US6619044B2 · kind B2 · utility
49Cited by
17References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.