Method and device for clamping electromagnetically molds of injection molding machine
US6619940B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Oct 24, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/645
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device for clamping electromagnetically molds of the injection molding machine comprises a stand on which a fixed board and a guiding mechanism are mounted. A movable board is slidably mounted on the guiding mechanism to slide back and forth in relation to the fixed board. The fixed board is provided with a male mold mounted thereon. The movable board is provided with a female mold mounted thereon. The sliding motion of the movable board toward the fixed board brings about the mold opening action, the mold closing action, and the mold locking action. The movable board and the fixed board are provided with a magnetic force generating mechanism for effecting attraction or repulsion between the movable board and the fixed board. The attraction serves to effect the mold closing action and the mold locking action. The repulsion serves to effect the mold opening action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.