Chip socket assembly and chip file assembly for semiconductor chips
US6619973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.