Abrasive composition containing organic particles for chemical mechanical planarization
US6620215B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Dec 21, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.