Process and device for the coating of substrates by means of bipolar pulsed magnetron sputtering and the use thereof
US6620299B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Process and device for coating substrates utilizing bipolar pulsed magnetron sputtering in the frequency range between 10 and 100 kHz, wherein the device includes at least three magnetron sources. Each of the at least three magnetron sources includes a target. At least two of the targets are connected to a potential-free bipolar power supply device. The at least three targets are arranged relative to the substrates in such a way that the substrates are located at least partially inside a discharge current during a coating of the substrates. A switching device is adapted to connect the targets to the bipolar power supply device. A technological predetermined program is used for controlling the switching device. The switching device connects at least two of the targets at a time to the bipolar power supply device according to the technologically predetermined program.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.