Patent · US Expired

Diamond compact

US6620375B1 · kind B1 · utility

32Cited by
5References
7Claims
0Family size

Inventors

Key dates

Filing dateDec 5, 2000
Grant dateSep 16, 2003
Priority date
Expiry dateDec 5, 2020

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB22F2998/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Disclosed is a method of making a composite diamond having a cutting edge comprising a diamond compact bonded to a cemented carbide substrate, the diamond compact having a working surface, an edge of which provides the cutting edge, wherein the diamond compact comprises a first phase containing a polycrystalline mass of diamond particles and a second phase containing a diamond catalyst/solvent and ruthenium, which method includes the steps of providing a cemented carbide substrate, providing a layer of diamond particles on a surface of the substrate, providing a source of diamond catalyst/solvent and ruthenium, wherein the source of the diamond catalyst/solvent and ruthenium is the cemented carbide substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.