Diamond compact
US6620375B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Dec 5, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed is a method of making a composite diamond having a cutting edge comprising a diamond compact bonded to a cemented carbide substrate, the diamond compact having a working surface, an edge of which provides the cutting edge, wherein the diamond compact comprises a first phase containing a polycrystalline mass of diamond particles and a second phase containing a diamond catalyst/solvent and ruthenium, which method includes the steps of providing a cemented carbide substrate, providing a layer of diamond particles on a surface of the substrate, providing a source of diamond catalyst/solvent and ruthenium, wherein the source of the diamond catalyst/solvent and ruthenium is the cemented carbide substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.