Method of accurately measuring compositions of thin film shape memory alloys
US6620634B2 · kind B2 · utility
54Cited by
1References
4Claims
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Key dates
| Filing date | Jan 17, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jan 17, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/2252
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of measuring with high accuracy the composition of shape memory alloy elements that are sputter deposited in thin film form. An element of known composition is polished with a flat surface. An element of unknown composition is sputter deposited onto the surface. Miniature openings are made by photography in the unknown layer, exposing an area of the known substrate. With adjacent areas of the two samples then only microns apart, accurate measurements of the compositions are made by comparing the X-ray spectra resulting from an electron beam scanning across the two areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.