Patent · US Expired

Method for manufacturing a thin-layer component, in particular a thin-layer high-pressure sensor

US6620644B2 · kind B2 · utility

2Cited by

2References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Andre Kretschmann · Reutlingen, DE
Ralf Henn · Singapore, SG
Volker Wingsch · Reutlingen, DE

Key dates

Filing date	Mar 23, 2001
Grant date	Sep 16, 2003
Priority date	—
Expiry date	Oct 12, 2021

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/066
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A manufacturing method for a thin-layer component, in particular a thin-layer high-pressure sensor, having a substrate on which the at least one functional layer to be patterned is to be deposited in the steps, preparing the substrate; depositing the functional layer on the substrate; and patterning the functional layer via a laser processing step, the laser processing step being selective with respect to the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.