Contact bonding adhesives
US6620870B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Nov 6, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/932
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Pressure-sensitive adhesives comprising an aqueous polymer dispersions wherein the polymer is composed offrom 50 to 99.9% by weight of at least one C1-C12 alkyl (meth)acrylate (monomers a)from 0.05 to 20% by weight of at least one vinylaromatic compound (monomers b)from 0.05 to 10% by weight of at least one ethylenically unsaturated hydroxy compound (monomers c)from 0 to 10% by weight of an ethylenically unsaturated acid or an acid anhydride (monomers d) andfrom 0 to 30% by weight of other ethylenically unsaturated compounds (monomers e)the weight percentages being based on the polymer, and the polymer dispersion comprising an emulsifier consisting to the extent of at least 5% by weight of aromatic carbon atoms (and called aromatic emulsifier for short) or an emulsifier mixture consisting to the extent of at least 10% by weight of an aromatic emulsifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.