Low shrinkage thermosetting resin compositions and methods of use thereof
US6620946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Apr 30, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2602/42
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.