Concealed biaxial card to frame grounding scheme
US6621002B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Mar 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ground from a printed circuit board to the frame of an electronic system is formed by a biaxially-compressible conductive spring that is captivated between the printed circuit board and a plastic stiffener to which the board is fastened. The spring makes contact with a ground pad on the underside of the printed circuit board. As the board is fully installed in the electronic system, standoffs attached to the system frame make contact with the conductive spring, completing the ground path. Keyhole-shaped cutouts in the printed circuit board secure the board without the use of tools. When the board assembly is lowered onto the standoffs, the head of the standoff passes through the circular opening of the keyhole. The board assembly is secured in place by sliding it on the standoffs to a position in which the head of the standoff is over the narrower slot portion of the keyhole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.