Multilayer integrated substrate and manufacturing method for multilayer ceramic element
US6621010B2 · kind B2 · utility
4Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Feb 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.