Semiconductor device and method of fabricating the same, circuit board, and electronic equipment
US6621172B2 · kind B2 · utility
104Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Apr 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first semiconductor chip is mounted on a substrate on which an interconnect pattern is formed, and a surface of the first semiconductor chip having electrodes faces the substrate. A second semiconductor chip is mounted on the first semiconductor chip. Electrodes of the second semiconductor chip are electrically connected to the interconnect pattern by wires. A first resin is provided between the first semiconductor chip and the substrate, and a second resin which differs from the first resin seals the first and second semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.