Electronic component cooling apparatus
US6621699B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing force transferring sections 37 for transferring a pushing force from mounting tools 35 to a heat sink 3 through contact with leading ends of radiation fins 11 are integrally formed on a pair of wall sections 25a of a casing 21. The pushing force transfer sections 37 have a shape that can distribute the pushing force and transfer distributed force to the heat sink 3 so as to prevent a force applied to an electronic component MPU by the pushing force from being locally and extremely increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.