Liquid-cooled electronic apparatus
US6621707B2 · kind B2 · utility
62Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Oct 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.