Method and arrangement for improving leak tolerance of an earpiece in a radio device
US6621910B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1998 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Oct 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to an arrangement for improving leak tolerance in an earpiece (100) of a radio device. The invention can be applied preferably in mobile stations. One idea of the invention is that an acoustic volume (111) is arranged behind the earpiece by taking advantage of the RF shield casing (112, 116) of a radio frequency unit of the device. By means of the invention one can form behind the earpiece an acoustic volume which loads optimally the earpiece without therefore needing to enlarge the size of the device. In an embodiment of the invention one wall of the casing arranged behind the earpiece has been formed by means of an electronic circuit board (112), to which circuit board radio frequency components (117) of an electronic unit have been connected. Then between the casing and the external volume one can preferably form an acoustic path by means of through holes (113, 114) arranged in the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.