Thin film structures in devices with a fiber on a substrate
US6621951B1 · kind B1 · utility
42Cited by
60References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3692
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Thin-film techniques in forming fiber devices that engage fibers to a substrate with different material properties. Structure buffering, diffusion bonding, and thickness monitoring may be achieved by such thin-film techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.