Linear via punch
US6622603B1 · kind B1 · utility
3Cited by
25References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 1997 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Mar 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/943
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for punching holes in a substrate which is disposed between a punch head with a fixed partial pattern of holes and a die having a full array pattern of holes. The punch head punches holes in the substrate by aligning with the die and contacting the substrate. Punches contained in the punch head articulate in at least one of x, y, and theta positions in order to precisely align with holes in the die thereby producing holes in the substrate which precisely match holes in the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.