Production of a tailless ball bump
US6622903B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2002 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a ball bump on a workpiece employs a capillary having a passageway therethrough. A wire extends through the passageway and has a ball formed on its end below the capillary. The capillary is positioned above a bond site and is lowered until the ball contacts the bond site. The capillary simultaneously applies ultrasonic energy and a downward force against the ball to deform the ball to a ball bump and bond it to the bond site. The capillary is thereafter displaced in a first direction to break the wire away from the ball bump. The capillary is then displaced in a second direction across the ball bump to engage any residual wire protruding from the ball bump surface and substantially smooth the residual wire against the ball bump surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.