High density electrical connector assembly with reduced insertion force
US6623310B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2002 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6658
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connector assembly includes an electrical receptacle connector (100; 300) and an electrical header connector (200; 400). The electrical receptacle connector includes an insulative housing (110; 310), a number of wafers (130; 350) accommodated in the insulative housing, and a number of inner printed circuit boards (120; 320). Each wafer has a wafer body (131; 3113), a number of signal contacts (132; 330) and a grounding bus (133; 340). Each inner printed circuit board has a mounting portion (124; 324) extending between two adjacent wafers to electrically contact with the signal contacts and the grounding buses and a mating portion (123; 323). The electrical header connector has an insulative housing (210; 410) and a number of wafers (220; 440) accommodated in the insulative housing to receive therebetween and electrically contact with the mating portions of the inner printed circuit boards of the electrical receptacle connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.